Comparison ledger
Applied Materials 0010-03485 Magnet Assy, ESPEC ETC 200 L Thermal, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | ETC 200 L ThermalESPEC |
|---|---|---|
| OEM | Applied Materials | ESPEC |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | ESPEC ETC 200 L Thermal |
| Specifications | ||
| Configuration | WP AL 300mm PVD[1] | — |
| OEM | Applied Materials[1] | — |
| Model | 0010-03485[1] | ETC 200 L[5] |
| Description | MAGNET ASSY, WP AL 300MM PVD[2] | — |
| Process | PVD[3] | — |
| Wafer size | 300mm[4] | — |
| Version | Spares[4] | — |
| Part Number | 0010-03485[1] | — |
| Manufacturer | Applied Materials[1] | ESPEC[5] |
| Process Type | PVD (Physical Vapor Deposition)[1] | — |
| Application (Material) | Aluminum (AL)[1] | — |
| Wafer Diameter (associated) | 300 mm[1] | — |
| Model number | — | ETC-200L[6] |
| Category | — | Temperature chamber[6] |
| Temperature range | — | -65 to +200 °C[6] |
| Control accuracy | — | ±0.1 °C[6] |
| Heating rate | — | Up to 10 °C/minute[6] |
| Cooling rate | — | Up to 20 °C/minute[6] |
| Temperature uniformity | — | ±1.5 °C[6] |
| System description | — | Thermal system for Summit with Thermochuck[6] |