Comparison ledger
ADT 7120 MD Dicing, Disco 3220, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | |
|---|---|---|
| OEM | ADT | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ADT 7120 MD Dicing | Disco 3220 |
| Specifications | ||
| Wafer size | 8 inch[1] | — |
| equipment type | — | dicing saw[2] |
| Workplace size | — | ø150 mm[3] |
| Spindle layout | — | Single[3] |
| Spindle output | — | 1.5 kW at 30,000 min-1[3] |
| Spindle max revolution speed | — | 40,000 min-1[3] |
| X-axis feed speed range | — | 0.1 – 500 mm/s[3] |
| Y-axis index step | — | 0.0001 mm[3] |
| Z-axis repeating accuracy | — | 0.001 mm[3] |
| Z-axis max blade size | — | ø58 mm[3] |
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