Comparison ledger
Accretech UF3000 Fully Automated, Tokyo Electron Precio XL, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF3000 Fully AutomatedAccretech | Precio XLTokyo Electron |
|---|---|---|
| OEM | Accretech | Tokyo Electron |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF3000 Fully Automated | Tokyo Electron Precio |
| Specifications | ||
| -Loader Type | TSK[2] | — |
| -Chuck Temperature Range | 30~150℃[2] | — |
| -OCR Camera Type | Type6[2] | — |
| -Auto Card Change | Yes[2] | — |
| -Needle Cleaning Unit | 150mm x 150mm Ceramics Pad[2] | — |
| -Manipulator | Hinge, MHF4000[2] | — |
| -Test System Interface | AL6050 & Focus3000[2] | — |
| Attachments | 10 Files[2] | — |
| Manufacturer | Accretech / TSK[2] | Tokyo Electron Limited[5] |
| Model | UF3000[2] | Precio XL[5] |
| Description | Fully Automated Prober[2] | — |
| Version | 300 mm[2] | — |
| Vintage | 01.05.2009[2] | — |
| Wafer size support | 200 mm (8") and 300 mm (12")[3] | — |
| Alignment accuracy | ±2 microns[3] | — |
| Z-axis accuracy | ±1 micron[4] | — |
| Maximum chuck temperature | 200°C[4] | — |
| Minimum chuck temperature | -40°C[4] | — |
| Probe card compatibility | Universal compatibility with various probe card types[4] | — |
| Throughput rate | Up to 300 wafers per hour[4] | — |
| Software version | S5.0FC4[2] | — |
| Includes | Printer[2] | — |
| S/W version | S5.0FC4[2] | — |
| Configuration | — | Single Open with Open Loader[1] |
| Hot Chuck Function | — | 50~150 deg[1] |
| Type | — | Automatic wafer prober[6] |
| Wafer size | — | 200 mm, 300 mm[5] |
| Accuracy | — | 1.8 µm[5] |
| Z accuracy | — | 5 µm[5] |
| Probing force | — | 200 kg, 300 kg[5] |
| Stage type | — | Linear Motor[5] |
| Functions | — | Focus OCR; hot chuck function 50~150 deg; WAPP function; 93K DD interface; flip SACC function; GPIB[1] |
| Category | — | Test & Probe[7] |
| Equipment type | — | Production Wafer Prober[7] |
| Main features | — | TELPADS-I, Auto Leveling, CoSMOz[6] |
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