Comparison ledger
Accretech AP 3000 e Automatic Wafer, Signatone 1070, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AP 3000 e Automatic WaferAccretech | 1070Signatone |
|---|---|---|
| OEM | Accretech | Signatone |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech AP 3000 | Signatone 1070 |
| Cited variants |
| — |
| Specifications | ||
| Configuration | Ultra High Performance[2] | — |
| Wafer size | 200mm (8-inch) and 300mm (12-inch)[3] | — |
| Overall precision | +/-0.8 µm and +/-1.5 µm (Accretech specified condition)[3] | — |
| Chuck temperature options | Ambient, Hot up to 200°C, Low down to -55°C[3] | — |
| Automatic probe card exchange (APC) | Available as option[3] | — |
| Loader configuration | Single or Dual loader with AMHS automation[3] | — |
| Make | — | Signatone[4] |
| Model | — | 1070[4] |
Plan your fab
Building a Test & Probe process? Get a complete equipment list.
Open the fab equipment planner →