Comparison ledger
ABM -407B-2-S-CE-S293 Robot, KLA Zeta 20, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Zeta 20KLA | |
|---|---|---|
| OEM | ABM | KLA |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-2-S-CE-S293 Robot | KLA Zeta 20 |
| Specifications | ||
| Model | ABM-407B-2-S-CE-S293[1] | — |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Type | — | Fully integrated optical profiling microscope[2] |
| Measurement capability | — | 3D metrology and imaging[2] |
| Operating mode | — | Non-contact 3D microscope and surface topography measurement system[2] |
| Technology | — | ZDot technology[2] |
| Optics | — | Multi-Mode optics[2] |
| Measurement techniques | — | White light interferometry, phase shifting interferometry, Nomarski interference contrast microscopy, shearing interferometry, and broadband reflectometry[2] |
| Film thickness measurement | — | Transparent film thickness measurement[2] |
| Applications | — | Sample review and automated defect inspection[2] |
| Environment | — | Supports both R&D and production environments[2] |
| Measurement range | — | Step heights from nanometers to millimeters[3] |
| Surface characterization | — | Surface roughness measurement for smooth and rough surfaces[3] |
| Objective lenses | — | Objective lenses up to 50x[4] |
| Software functions | — | Sample mapping, image stitching, and automated feature detection[4] |
| Sample load mode | — | Manual sample load[3] |
| Tool type | — | Fully integrated optical profiling microscope[2] |
| Metrology capability | — | 3D metrology and imaging[4] |
| Measurement technology | — | ZDot technology[2] |
| Measurement mode | — | White light interferometry[2] |
| Additional measurement techniques | — | Confocal microscopy, vertical scanning interferometry, phase shifting interferometry, thin film reflectometry, and differential interference contrast imaging[4] |
| Operating environments | — | R&D and production environments[2] |
| Film thickness range | — | Transparent film thickness from 30nm to 100µm[2] |
| Defect inspection capability | — | Capture defects greater than 1µm[2] |
| Wafer handling | — | Manual sample load[3] |
| Maximum objective lens | — | Up to 50x[4] |
| Intro year | — | 2007[5] |