Comparison ledger
ABM -407B-1-S-CES293 Robot, EV Group 310, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 310EV Group | |
|---|---|---|
| OEM | ABM | EV Group |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | unified GUI program platform called EVG CIMFramework |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | EV Group 310 |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[1] | — |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Tool name | — | EVG 310[2] |
| Type | — | single wafer cleaner[2] |
| Cleaning function | — | megasonic DI water cleaner[2] |
| Modules | — | cleaning module (CLM) and pre-bond station and infrared lamp imaging module (IRM)[2] |
| Cleaning use | — | used to clean wafers[2] |
| Pre-bond use | — | used to put wafers in contact (prebond)[2] |
| Imaging use | — | used to image through the wafer stack with infrared illumination to look for bonding defects (voids)[2] |