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Comparison ledger

-407B-1-S-CES293 RobotversusTopaz X II Placement

ABM -407B-1-S-CES293 Robot, Assembleon Topaz X II Placement, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMABMAssembleon
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyABM -407B-1-S-CES293 RobotAssembleon Topaz X II Placement
Cited variants—
  • Topaz-XII with FNC head (PA 1314/01)[1]
  • Topaz-XII with SF head (PA 1314/02)[1]
Specifications
ModelABM-407B-1-S-CES293[2]—
DescriptionROBOT[2]—
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2]—
Phase—3 Phase[3]
Frequency—60 Hz[3]
Placement Speed (optimal)—20,000 CPH[4]
Placement Speed (IPC 9850)—15,400 CPH[4]
Placement Accuracy (3σ, chips)—±50 µm[4]
Placement Accuracy (3σ, QFP 0.4mm pitch)—±35 µm[4]
Maximum Board Size (L x W)—460 x 440 mm[4]
Minimum Board Size (L x W)—50 x 50 mm[4]
Large Board Application—650 x 850 mm[4]
Board Thickness—0.4 to 4.0 mm[4]
Component Range—01005 (0402) to 45 x 100 mm (BGA, µBGA, CSP, Connector, Odds)[4]
Maximum Component Height—11 mm (with area CCD camera)[4]
Head Design (SF)—One single beam with 8 super fine heads[4]
Head Design (FNC)—One single beam carrying 4 standard heads and 4 heads with nozzle exchange on-the-fly[4]
Footprint (L x W)—1650 x 1408 mm[4]
Operating System—Windows NT[4]
Tape Feeding Positions (8mm)—90 (CLi) or 160 (ITF)[4]
Tray Feeding—LCS tray feeder with 40 pallets, single ATS tray feeder with 20 pallets[4]
Feeder Trolleys—4 x 20 position (CLi) or 4 x 20 position (ITF)[4]
Alignment Principle—Line array camera, area CCD camera, co-planarity check on-the-fly[4]
Sources (4)Every fact above is drawn from these public sources
  1. [1]scribd.comscribd.com
  2. [2]dealer listingsemistarcorp.com
  3. [3]inventory listing
  4. [4]efsmt.comefsmt.com